KAPSA Semicon
Overview
Packaging is where many reliability problems begin: voids in die attach, weak wire bonds, moisture ingress or warpage under thermal load. Because we test and analyse packaged devices every day, we bring a reliability-first perspective to packaging design and assembly.
From selecting the right package for a new device to developing assembly processes and qualifying the result, our packaging engineers work alongside your design and manufacturing teams.
Capabilities
Package design & selection
Choosing package type, materials and layout for electrical, thermal and mechanical requirements.
Die attach
Epoxy, solder and sintered die-attach processes with void and bond-line control.
Wire bonding
Gold, copper and aluminium wire-bond process development with pull and shear verification.
Flip-chip & bumping
Support for flip-chip interconnect, underfill selection and joint reliability.
Encapsulation & moulding
Mould compound selection and process optimisation to prevent delamination and voids.
Advanced packaging
Engineering support for system-in-package (SiP), 2.5D/3D and heterogeneous integration.
Thermal & mechanical analysis
Evaluation of heat dissipation, warpage and stress in package structures.
Package qualification
Moisture sensitivity (MSL), preconditioning and package-level reliability testing.
Relevant standards
- J-STD-020 (MSL)
- JESD22-A113 (Preconditioning)
- JESD22-B116 (Wire bond shear)
- MIL-STD-883
- AEC-Q100
Who it's for
Fabless companies taking a design to package for the first time, OSATs developing new package types, and product teams resolving package-related failures.