Overview

A failure is only useful if you understand it. Our failure-analysis workflow moves step by step from non-destructive inspection to targeted destructive analysis — preserving evidence at every stage so the true root cause is not lost.

We analyse integrated circuits, discrete and power devices, passive components, packages and assembled boards, and present findings in a clear report with images, mechanisms and corrective-action recommendations.

Capabilities

X-ray inspection

2D/3D X-ray to examine wire bonds, die attach voids, solder joints and internal structures without opening the part.

Acoustic microscopy (C-SAM)

Scanning acoustic microscopy to detect delamination, cracks and voids inside packages.

Decapsulation

Controlled chemical or laser removal of mould compound to expose the die and bonds for inspection.

Cross-section analysis

Precision sectioning and polishing to reveal internal layers, interfaces and solder microstructure.

SEM imaging

High-magnification scanning electron microscopy of defects, fractures and surface features.

FIB analysis

Focused ion beam cross-sections at exact defect sites for nanometre-scale inspection.

Wire bond analysis

Bond pull, ball shear and intermetallic inspection to assess interconnect quality.

Electrical fault isolation

Curve tracing and electrical characterisation to localise shorts, opens and leakage paths.

Analyst examining a sample through a microscope — Analysis moves from non-destructive to destructive techniques to preserve evidence.

Our approach

Failure verification
Review history and confirm the failure electrically.
Non-destructive analysis
Optical, X-ray and acoustic inspection to locate anomalies.
Fault isolation & destructive analysis
Decapsulation, cross-sectioning, SEM/FIB and materials analysis at the defect site.
Root cause & recommendations
A report linking the physical defect to its mechanism and corrective actions.

Relevant standards

Who it's for

Quality and reliability teams handling customer returns, qualification failures or yield excursions — and anyone who needs an independent, defensible explanation of why a part failed.

Failure analysis that finds the real root cause