Service 02 · Reliability Engineering

Reliability qualification to JEDEC and AEC-Q100

Accelerated stress testing that proves your devices will keep performing — through years of heat, humidity, power cycling and harsh environments.

Overview

Customers in automotive, industrial, aerospace and medical markets expect proof that a device will survive its full mission life. Reliability engineering provides that proof by applying controlled, accelerated stresses and measuring how devices respond.

KAPSA Semicon designs and runs qualification programmes aligned to JEDEC and AEC standards, or to your own mission profile. We combine environmental chambers, bias and monitoring with the engineering judgement to interpret the results.

Capabilities

JEDEC qualification

Stress-test-driven qualification using JESD47 and the JESD22 family of test methods.

AEC-Q100 qualification

Automotive qualification of integrated circuits by temperature grade, including stress sequences and sample planning.

Thermal cycling & shock

Temperature cycling to expose solder, bond and package fatigue from thermal expansion mismatch.

THB

Temperature-humidity-bias testing (85 °C / 85 % RH) to reveal corrosion and moisture-driven failures.

HAST

Highly accelerated stress testing — a faster, pressurised alternative to THB for moisture robustness.

HALT

Highly accelerated life testing to find design weaknesses and operating margins early in development.

Environmental testing

Temperature, humidity, vibration and mechanical shock exposure aligned to IEC 60068 and MIL-STD methods.

Life testing

High-temperature operating life (HTOL) and storage life testing with in-situ or interim electrical checks.

Rendered close-up of a processor package on a circuit board
Qualification plans are tailored to device technology, package and end-application.

What you receive

  • A qualification plan mapped to the applicable standard and your mission profile
  • Pre- and post-stress electrical data with parametric drift analysis
  • A qualification report suitable for customer submission
  • Root-cause support through our failure analysis team if any device fails

Relevant standards

  • JESD47
  • JESD22-A101 (THB)
  • JESD22-A104 (Temp cycling)
  • JESD22-A108 (HTOL)
  • JESD22-A110 (HAST)
  • AEC-Q100
  • AEC-Q101
  • AEC-Q200
  • IEC 60068
  • MIL-STD-883

Who it's for

Semiconductor companies preparing devices for automotive and industrial customers, OEMs qualifying second sources, and engineering teams who need to understand margins before a design freeze.

Have a device, board or failure to investigate?

Share your requirement and our engineers will come back with a test plan, timeline and quotation — usually within one business day.