Overview
Customers in automotive, industrial, aerospace and medical markets expect proof that a device will survive its full mission life. Reliability engineering provides that proof by applying controlled, accelerated stresses and measuring how devices respond.
KAPSA Semicon designs and runs qualification programmes aligned to JEDEC and AEC standards, or to your own mission profile. We combine environmental chambers, bias and monitoring with the engineering judgement to interpret the results.
Capabilities
JEDEC qualification
Stress-test-driven qualification using JESD47 and the JESD22 family of test methods.
AEC-Q100 qualification
Automotive qualification of integrated circuits by temperature grade, including stress sequences and sample planning.
Thermal cycling & shock
Temperature cycling to expose solder, bond and package fatigue from thermal expansion mismatch.
THB
Temperature-humidity-bias testing (85 °C / 85 % RH) to reveal corrosion and moisture-driven failures.
HAST
Highly accelerated stress testing — a faster, pressurised alternative to THB for moisture robustness.
HALT
Highly accelerated life testing to find design weaknesses and operating margins early in development.
Environmental testing
Temperature, humidity, vibration and mechanical shock exposure aligned to IEC 60068 and MIL-STD methods.
Life testing
High-temperature operating life (HTOL) and storage life testing with in-situ or interim electrical checks.
What you receive
- A qualification plan mapped to the applicable standard and your mission profile
- Pre- and post-stress electrical data with parametric drift analysis
- A qualification report suitable for customer submission
- Root-cause support through our failure analysis team if any device fails
Relevant standards
- JESD47
- JESD22-A101 (THB)
- JESD22-A104 (Temp cycling)
- JESD22-A108 (HTOL)
- JESD22-A110 (HAST)
- AEC-Q100
- AEC-Q101
- AEC-Q200
- IEC 60068
- MIL-STD-883
Who it's for
Semiconductor companies preparing devices for automotive and industrial customers, OEMs qualifying second sources, and engineering teams who need to understand margins before a design freeze.
